Bond Application

If a bond is required on a form in the Submission Manager, the bonding process will also be online. Click on the Bond Application icon in the Submission Manager and fill in the form. All yellow fields are MANDATORY.

Bond Application

Once you have filled in all of the details that are necessary for you to obtain the correct bond, go to the bottom of the form and enter the email address of your bonding company or risk management contact within your company.

The last step is to determine who will be signing the completed bond. Select the appropriate radio button stating that you ARE or ARE NOT authorized to sign the bond on behalf of your firm.

If you are not authorized to sign the bond, enter in the email address of the individual that is authorized in the field at the very bottom of the page. When you submit the form, both the Broker and the Authorized Signatory will receive an email informing them of your bond request.

If you are not yet ready to submit your application, you can Save the form as a Draft and return later to finish and submit it.

Bond Application

After you have submitted the application, you will receive an email when your bonding agent has issued the bond. If you require someone else to sign the bond, you will receive the email once they have signed it. The bond will be then available in the Submission Manager where you will be able to attach it to your submission.

If the information on your bond is not correct, or for some reason you need the Bonding Agent to provide a new bond, you will have to re-apply for a bond. Make any necessary adjustments to your application form and re-submit it. They will then upload a new bond and it will overwrite the previous one.

Related Topics: Signing and Attaching the Bond to your Submission

 

When submitting a bond online with your bid, you are not required (or able) to put a ‘wet’ signature on the bond, however you are required to digitally sign the bond and check the ‘Attach Bond’ box to include it with your online bid submission.

Bond Application